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| FBGA256 17x17mm |
LQFP144 20x20mm |
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AG6K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs.
Features
- High-density architecture with 6K LEs
- M9K embedded memory blocks, up to 414Kbits of RAM space
- Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
- Provides 2 PLLs per device provide clock multiplication and phase shifting
- High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
- Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
- General package options, LQFP-144, -176 and FBGA-256
- Flexible device configuration through JTAG and SPI interface
- Support remote update, by "dual-boot" like implementation
Download Datasheet
EVB Schematics
Pinout