FBGA256 17x17mm	LQFP144 20x20mm	EQFP176 20x20mm

AG10K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG10K offers supreme quality, stability, and exceptional pricing value.

Features

• High-density architecture with 10K LEs
• M9K embedded memory blocks, up to 414Kbits of RAM space
• Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
• Provides 2 PLLs per device provide clock multiplication and phase shifting
• High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
• Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
• General package options, LQFP-144, -176 and FBGA-256
• Flexible device configuration through JTAG and SPI interface
• Support remote update, by "dual-boot" like implementation
• Refer "User Guide" for special AS mode configuration

Download Datasheet

EVB Schematics

AG10K Pinout

The new device AG10KL144H ，provide higer performance and in-line debugging.

AG10KSDE176 device is AG10K FPGA bonded with 64MBit 32-bit 166MHz SDRAM. AG10KSDE176 is pin-to-pin compatible with AG16KSDE176.

Download Datasheet

EVB Schematics